Publication

Test chip for the development and evaluation of test structures for measuring stress in metal interconnect (2004)

Author(s): Terry JG; Wright NG; O'Neill AG; Bull SJ; Smith S; Walton AJ; Gundlach AM; Stevenson JTM; Horsfall AB; Wang K; Dos Santos JMM; Soare SM

      • Conference Name: IEEE International Conference on Microelectronic Test Structures
      • Pages: 69-73
      • Publisher: Institute of Electrical and Electronics Engineers
      • Publication type: Conference Proceedings (inc. abstract)
      • Bibliographic status: Published
        Staff

        Professor Anthony O'Neill
        Siemens Professor of Microelectronics

        Professor Nick Wright
        Pro-Vice-Chancellor