Publication

Influence of barriers on the reliability of dual damascene copper contacts (2008)

Author(s): Wang K; Wilson CJ; Cuthbertson A; Herberholz R; Coulson HP; O'Neill AG; Horsfall AB

      • Conference Name: IEEE International Reliability Physics Symposium Proceedings
      • Pages: 677-678
      • Publisher: IEEE
      • Publication type: Conference Proceedings (inc. abstract)
      • Bibliographic status: Published
      Staff

      Professor Anthony O'Neill
      Siemens Professor of Microelectronics