Publication
Analysis of a passive sensor for predicting process-induced stress in advanced integrated circuit interconnect (2008)
Author(s): Gallacher B, O'Neill A, Bull S, Wilson C, Horsfall A
- Journal: IEEE Transactions on Device and Materials Reliability
- Volume: 8
- Issue: 1
- Pages: 174-181
- Publisher: IEEE
- Publication type: Article
- Bibliographic status: Published