Publication
Vacancy engineering - An ultra-low thermal budget method for high-concentration 'diffusionless' implantation doping (2008)
Author(s): Cowern NEB; Pakfar A; Smith AJ; Bennett N; Sealy BJ; Gwilliam R; Webb RP; Colombeau B; Paul S; Lerch W
- Conference Name: Rapid Thermal Processing and beyond: Applications in Semiconductor Processing
- Volume: 573-574
- Pages: 295-304
- Publisher: Trans Tech Publications Ltd.
- Publication type: Conference Proceedings (inc. abstract)
- Bibliographic status: Published