Publication
Vacancy engineering - An ultra-low thermal budget method for high-concentration 'diffusionless' implantation doping (2008)
Author(s): Cowern NEB, Smith AJ, Bennett N, Sealy BJ, Gwilliam R, Webb RP, Colombeau B, Paul S, Lerch W, Pakfar A
- Conference Name: Rapid Thermal Processing and beyond: Applications in Semiconductor Processing
- Volume: 573-574
- Pages: 295-304
- Publisher: Trans Tech Publications Ltd.
- Publication type: Conference Proceedings (inc. abstract)
- Bibliographic status: Published