Vacancy engineering - An ultra-low thermal budget method for high-concentration 'diffusionless' implantation doping (2008)

Author(s): Cowern NEB, Smith AJ, Bennett N, Sealy BJ, Gwilliam R, Webb RP, Colombeau B, Paul S, Lerch W, Pakfar A

      • Conference Name: Rapid Thermal Processing and beyond: Applications in Semiconductor Processing
      • Volume: 573-574
      • Pages: 295-304
      • Publisher: Trans Tech Publications Ltd.
      • Publication type: Conference Proceedings (inc. abstract)
      • Bibliographic status: Published

      Professor Nick Cowern
      Professor of Nanoscience / Nanotechnology