Author(s): Horsfall AB, dos Santos JMM, Soare SM, Wright NG, O'Neill AG, Bull SJ, Walton AJ, Gundlach AM, Stevenson JTM
Abstract: Residual stress in multilevel interconnects is a potential road block for the ITRS. Direct measurement of stress in interconnect tracks has been demonstrated for the first time using a rotating sensor fabricated in metallisation layers. The rotation is observable with a reflected light microscope and is compared with computer simulations using ANSYS. The structure is suitable for use in a production environment and is scalable to deep submicron features for future technology nodes. (8 References).
Notes: Franca J Freitas P Piscataway, NJ, USA. ESSDERC 2003. Proceedings of the 33rd European Solid-State Device Research - ESSDERC '03. Estoril, Portugal. IEEE. EDS. Infineon Technol. ATMEL. Tower Semiconductor Ltd. 16-18 Sept. 2003.