Publication:

Simple computer modeling of the grain microstructure of Al-4wt%Cu interconnection lines (1997)

Author(s): Low KS; Bull SJ; O'Neill AG

      • Conference Name: Polycrystalline Thin Films - Structure, Texture, Properties and Applications III
      • Volume: 472
      • Pages: 191-196
      • Publisher: Materials Research Society
      • Publication type: Conference Proceedings (inc. abstract)
      • Bibliographic status: Published