Test chip for the development and evaluation of test structures for measuring stress in metal interconnect (2004)

Author(s): Terry JG, Smith S, Walton AJ, Gundlach AM, Stevenson JTM, Horsfall AB, Wang K, Dos Santos JMM, Soare SM, Wright NG, O'Neill AG, Bull SJ

      • Conference Name: IEEE International Conference on Microelectronic Test Structures
      • Pages: 69-73
      • Publisher: Institute of Electrical and Electronics Engineers
      • Publication type: Conference Proceedings (inc. abstract)
      • Bibliographic status: Published