Analysis of a passive sensor for predicting process-induced stress in advanced integrated circuit interconnect (2008)

Author(s): Gallacher B, O'Neill A, Bull S, Wilson C, Horsfall A

      • Journal: IEEE Transactions on Device and Materials Reliability
      • Volume: 8
      • Issue: 1
      • Pages: 174-181
      • Publisher: IEEE
      • Publication type: Article
      • Bibliographic status: Published

      Professor Steve Bull
      Cookson Group Chair of Eng Materials

      Dr Barry Gallacher
      Reader in Engineering Dynamics

      Professor Anthony O'Neill
      Siemens Professor of Microelectronics